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(R)
TSH690
40MHz to 1GHz AMPLIFIER
. . . . . . . .
1.5V to 5V OPERATING VOLTAGE 28dB GAIN @ 3V @ 450MHz 20dB GAIN @ 3V @ 900MHz +13.5dBm OUTPUT POWER (P1dB) BIAS PIN FOR CURRENT ADJUST & AMPLIFIER DISABLE ADJUSTABLE OUTPUT POWER 50 INPUT/OUTPUT MATCHING FULLY GUARANTEED AT 2.7V
DESCRIPTION TSH690 is a wide band RF amplifier, consisted of 2 stages, designed in advanced bipolar process featuring 28dB gain and +13.5dBm output power at 450MHz under 3V. The pin 8 allows an external bias current adjust to tune the output power and also to set the amplifier in power-down mode. This powerful amplifier is dedicated to equip secured RF data transmitters as antenna drivers in ISM band (reliable RF meter-reading systems, secured Remote Controls, Cordless Telephones, ...) PIN CONNECTIONS (top view)
D SO8 (Plastic Micropackage)
ORDER CODES
Part Number TSH690ID Temperature Range -40, +85 C
o
Package D *
RF out
1
8
Vbias
GND 2 GND GND 3 4
7 VCC 6 GND
5 RF in
September 1998
1/10
TSH690
SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol VCC1, VCC2, Vbias RF in RF out Toper Tstg Parameter Supply Voltages & Bias Voltage RF Input Power RF Output Power Operating Free Air Temperature Range Storage Temperature Range Value 5.5 +10 +21 -40 to +85 -65 to +150 Unit V dBm dBm o C o C
OPERATING CONDITIONS
Symbol VCC1, VCC2 Vbias RFsr Parameter Supply Voltages Bias Voltage RF Signal Range Value 1.5 to 5 0 to 6 40 to 1000 Unit V V MHz
ESD SENSITIVE DEVICE Handling Precautions Required
2/10
TSH690
ELECTRICAL CHARACTERISTICS T amb = 25oC, VCC & Vbias = +2.7V, ZL = 50
Parameter Min. Supply Current S21 (Vin = -20dBm, f = 450MHz) S21 (Vin = -20dBm, f = 900MHz) Output Power 1dB Compression (f = 450MHz) 3rd Order Intercept Point (f = 430MHz) S12 (Reverse Isolation @ f = 400MHz) S11 (Input Return Loss @ f = 450MHz) S11 (Input Return Loss @ f = 900MHz) Noise Figure @ f = 450MHz Noise Figure @ f = 900MHz Rth(j-a) Junction Ambient Thermal Resistance For SO8 Package
All parameters with min. or max. figures are 100% tested.
TSH690 Typ. 46 23 17 8 16 12 22 -46 -10 -15 -10 4.5 5.4 140 180 30 Max.
Unit mA dB dB dBm dBm dB dB dB dB dB
o
40 20
C/W
SO8 PACKAGE THERMAL RESISTIVITY
Tamb (C)
150 135 120 105 90 75 60 45 30 1 2 3
Vcc (V)
Rthmin Rthmax
DEVICE OVERSTRESSED
RIGHT BEHAVIOUR
4
5
6
DEFINITION Rth(j-a) Junction Ambient Thermal Resistance Maximum Die Junction Temperature Tj (oC) (~ 150oC) o Tamb ( C) Ambient Temperature Pd (W) Maximum Dissipated Power (Pd = 0.75 VCC * ICC)
REMARKS The right behaviour is obtained when the following equation is fulfilled. Tj - Tamb = Pd * Rth(j-a)
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TSH690
TYPICAL SCATTERING PARAMETERS (Reference waves planes at package leads)
TEST CONDITIONS VCC1, VCC2, Vbias = +2V, Pin = -40dBm, T amb = 25oC
Freq MHz 40 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 Mag 0.642 0.615 0.537 0.490 0.464 0.428 0.413 0.373 0.334 0.312 0.290 0.302 0.324 0.335 0.349 0.368 0.366 0.373 0.374 0.381 0.377 S11 Ang -22.0 -25.7 -41.3 -55.6 -68.0 -79.0 -92.1 -101.5 -106.7 -111.5 -112.5 -114.5 -118.2 -122.9 -129.6 -135.0 -142.1 -147.9 -154.1 -159.0 -165.8 Mag 6.319 6.406 7.643 9.353 11.502 13.856 16.229 18.019 19.110 19.159 18.154 16.778 15.075 13.482 11.992 10.750 9.453 8.598 7.783 7.117 6.500 S21 Ang 5.0 7.1 7.7 3.1 -5.7 -18.0 -33.4 -51.2 -70.1 -90.3 -108.0 -124.8 -140.5 -153.6 -165.5 -177.2 173.4 165.0 155.8 146.7 138.9 Mag 0.003 0.008 0.002 0.004 0.007 0.003 0.005 0.008 0.008 0.008 0.008 0.010 0.015 0.011 0.011 0.019 0.011 0.015 0.013 0.017 0.013 S12 Ang -126.5 170.7 70.1 -141.9 -117.3 162.3 142.1 101.4 115.2 169.9 111.5 92.1 93.6 109.6 101.7 82.4 79.5 60.2 89.7 111.3 82.2 Mag 0.715 0.631 0.369 0.253 0.202 0.203 0.209 0.263 0.326 0.382 0.395 0.425 0.424 0.427 0.425 0.414 0.413 0.432 0.438 0.447 0.462 S22 Ang -54.7 -64.7 -91.3 -100.9 -100.9 -92.7 -87.6 -89.4 -99.7 -112.1 -122.9 -130.0 -139.6 -150.8 -159.0 -169.5 -177.8 176.2 166.4 160.8 155.1
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TSH690
TEST CONDITIONS VCC1, VCC2, Vbias = +3V, Pin = -40dBm, T amb = 25oC
Freq MHz 40 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 S11 Mag 0.616 0.595 0.513 0.470 0.436 0.402 0.382 0.343 0.302 0.279 0.271 0.280 0.306 0.315 0.330 0.333 0.343 0.346 0.354 0.347 0.355 Ang -23.3 -27.0 -43.4 -57.7 -71.1 -82.2 -95.0 -103.3 -109.7 -114.8 -114.0 -116.1 -119.8 -125.5 -131.1 -136.2 -142.5 -148.0 -155.1 -159.6 -166.2 Mag 9.237 9.402 11.263 13.566 16.434 19.416 22.265 24.337 25.564 25.594 24.292 22.527 20.511 18.282 16.311 14.604 12.860 11.668 10.579 9.652 8.775 S21 Ang 6.2 7.9 6.5 0.9 -8.6 -21.3 -36.6 -53.7 -71.8 -91.2 -108.3 -124.7 -140.1 -153.2 -165.1 -177.1 173.6 165.1 156.0 147.0 139.2 Mag 0.002 0.005 0.006 0.006 0.007 0.007 0.005 0.008 0.010 0.008 0.011 0.013 0.005 0.006 0.007 0.012 0.017 0.014 0.018 0.013 0.018 S12 Ang -135.8 -169.5 -153.8 94.5 155.8 154.1 7.2 40.6 125.9 167.1 120.2 101.0 89.9 107.2 78.9 84.5 76.0 90.8 75.6 66.6 75.3 Mag 0.733 0.651 0.381 0.227 0.156 0.134 0.135 0.193 0.269 0.316 0.356 0.396 0.404 0.400 0.406 0.398 0.399 0.411 0.413 0.439 0.459 S22 Ang -56.9 -67.7 -101.7 -119.1 -117.5 -100.3 -75.7 -78.0 -86.1 -100.6 -111.0 -119.3 -131.3 -142.6 -151.6 -160.4 -170.5 -178.8 170.9 165.2 157.3
TEST CONDITIONS VCC1, VCC2, Vbias = +4V, Pin = -40dBm, Tamb = 25oC
Freq MHz 40 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 S11 Mag 0.614 0.590 0.508 0.465 0.429 0.396 0.371 0.335 0.295 0.275 0.265 0.282 0.296 0.314 0.321 0.334 0.339 0.348 0.340 0.352 0.341 Ang -23.1 -27.4 -44.6 -59.9 -72.0 -83.4 -94.7 -103.8 -109.9 -114.8 -114.8 -117.0 -120.3 -124.7 -131.5 -135.8 -143.8 -149.4 -157.5 -161.0 -166.8 Mag 11.023 11.248 13.262 15.736 18.727 21.837 24.804 26.854 28.077 28.113 26.710 24.831 22.620 20.235 18.081 16.178 14.235 12.941 11.693 10.670 9.683 S21 Ang 6.9 7.9 4.5 -2.0 -11.5 -24.2 -39.3 -56.0 -73.6 -92.5 -109.4 -125.5 -140.8 -154.1 -166.2 -178.0 172.5 164.1 154.9 145.7 137.6 Mag 0.002 0.003 0.004 0.006 0.003 0.002 0.009 0.006 0.003 0.010 0.007 0.007 0.007 0.005 0.010 0.012 0.010 0.014 0.014 0.006 0.016 S12 Ang 107.6 -111.3 -47.0 -62.5 97.7 -135.5 154.7 135.2 139.7 97.0 111.8 93.8 110.0 85.1 93.2 106.1 74.1 57.9 80.2 87.4 50.0 Mag 0.726 0.646 0.366 0.206 0.130 0.108 0.136 0.191 0.262 0.321 0.335 0.389 0.393 0.402 0.388 0.390 0.377 0.392 0.402 0.409 0.433 S22 Ang -54.4 -65.1 -97.6 -110.4 -104.3 -78.6 -56.7 -64.3 -75.2 -85.8 -98.2 -108.5 -121.0 -131.7 -143.9 -153.8 -162.4 -170.4 179.5 171.4 163.3
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TSH690
Figure 1 : Typical 300MHz-1000MHz Biasing Circuit
APPLICATIONS INFORMATION
CIRCUIT DESCRIPTION The TSH690 is 50 input/outputinternallymatched from 300MHz to 1000MHz. Due to its open-collector structure, the output RF port must be tied to Vcc2. The pin 8 allows a bias current adjust to set the output power and the gain. The circuit is packaged in SO8 for thermal dissipation considerations. MATCHING Within the 300-1000MHz band, although the circuit is matched, the output return loss can be improved by adding a serial inductor (L2) between the RF output and VCC2 (56nH @ 450MHz and 10nH @ 900MHz). Below 300MHz, using the S-parameters matrix, specific input/outpu t matching networks can be calculated to maximize electrical performances. DC BLOCKING Because input/output are respectively internal/external biased, DC blocks (C1, C2) are recommended on both RF ports to guarantee a DC isolation from the next cells. Above 500MHz, 100pF is suggested whereas below, 1nF is better and far below (less than 100MHz), 10nF is prefered. BIASING The amplifier can operate in the range of 1.5V to 5V and offers a bias current adjust function (Vbias pin) which enables the trimming of the RF output power (AB class Amplifier) by tuning a series variable resistor (Rbias). When Vbias is wired to the Vcc rail, the current consumption is maximized getting the best linearity (A class Amplifier) whereas biasing to Ground, the IC is set in power down mode. For higher supply voltage than 4V to reach high output power, the serial resistor (R1) is strongly recommended to increase the efficiency of the amplifier and therefore reduce the thermal dissipation of the circuit. DECOUPLING As with any RF devices, the supply voltage decoupling must be done carefully using a 1nF bypass capacitor (C3, C5) placed as close as possible to the device pins and could be also improved by adding a 150nH RF choke inductance (L1). Concerning the Vbias pin, a 10nF decoupling capacitor (C4) is recommended while placing on board is not critical. Note that Surface Mounted Devices (SMD) components are prefered for RF applications due to the right behaviour in high frequencies while low inductor values (few 10nH) can be printed on board.
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TSH690
GAIN vs FREQUENCY (450MHz)
30 -40C +25C V +85C Gain (dB)
GAIN vs FREQUENCY (900MHz)
30 -40C +25C V +85C
25
25
Gain (dB)
20
20
15
15
L2 =10nH (450MHz Operation) Vcc=Vbias=3V
10 100 200 300 400 500 600 Freq (MHz) 700 800 900 1000 10 100 200 300
L2 =10nH (900MHz Operation) Vcc=Vbias=3V
400 500 600 Freq (MHz) 700 800 900 1000
INPUT RETURN LOSS (450MHz)
0
INPUT RETURN LOSS (900MHz)
0
-5
-5
-15
S11 (dB)
-10 S11 (dB)
2V
3V
-10
2V
3V
-15 4V 4V
-20
Vcc=Vbias @ Ta=+ 25C L2=56nH (450MHz operation)
-20
Vcc=Vbias @ Ta=+25C L2 =10nH (900MHz operation)
-25 100
200
300
400
500 600 Freq (MHz)
700
800
900
1000
-25 100
200
300
400
500 600 Freq (MHz)
700
800
900
1000
OUTPUT RETURN LOSS (450MHz)
0
OUTPUT RETURN LOSS (900MHz)
0
-5 3V 2V S22 (dB) -10 S22 (dB) 4V -15
-5 2V -10
3V
-15
4V
-20
-20
Vcc=Vbias @ Ta=+ 25C L2=56nH (450MHz operation)
-25 100 200 300 400 500 600 Freq (MHz) 700 800 900 1000 -25 100
Vcc=Vbias @ Ta=+25C L2=10nH (900MHz operation)
200 300 400 500 600 Freq (MHz) 700 800 900 1000
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TSH690
REVERSE ISOLATION vs FREQUENCY
0
1dB COMPRESSION vs BIAS VOLTAGE
20
-10 15 -20 P1dB (dBm) S12 (dB) Vcc = 3V 10 Vcc = 4V
-30 L2=10nH -40
L2=56nH
Vcc = 2V 5 -50
Vcc=Vbias=3V Ta=+25C
200 300 400 500 600 Freq (MHz) 700 800 900 1000 0 1,5 2 2,5
Ta=25C L2 =10nH (900MHz operation)
-60 100
3 Vbias (V)
3,5
4
ADMISSION (900MHz)
20
SUPPLY CURRENT vs BIAS VOLTAGE
60 6
Icc total
15
40
Pout (dBm) +85C 10 +25C
4 I bias (mA) 2 0 0 0,5 1 1,5 Vbias (V) 2 2,5 3
Icc total (mA)
I bias 20
5
-40C
Vcc=Vbias=3V L2 =10nH (900MHz operation ) 0 -20
Vcc=3V, Ta=+25C Pin = -40dBm
0
-15
-10 Pin (dBm)
-5
0
8/10
TSH690
DEMONSTRATION BOARD : Diagram for 300MHz - 1000MHz operation
DEMONSTRATION BOARD : Silk Screen
DEMONSTRATION BOARD : Printed Circuit Board (available on request)
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TSH690
PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (SO)
Dim. A a1 a2 a3 b b1 C c1 D E e e3 F L M S
Min. 0.1 0.65 0.35 0.19 0.25 4.8 5.8
Millimeters Typ.
Max. 1.75 0.25 1.65 0.85 0.48 0.25 0.5 45 (typ.) 5.0 6.2
o
Min. 0.004 0.026 0.014 0.007 0.010 0.189 0.228
Inches Typ.
Max. 0.069 0.010 0.065 0.033 0.019 0.010 0.020 0.197 0.244
1.27 3.81 3.8 0.4 4.0 1.27 0.6 8 (max.)
o
0.050 0.150 0.150 0.016 0.157 0.050 0.024
SO16.TBL ORDER CODE :
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publ ication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a trademark of STMicroelectronics (c) 1998 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. (c) http://www.st.com
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PM-SO16.EPS

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